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"koike junichi"
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| 國立交通大學 |
2020-03-09 |
Polydopamine and Its Composite Film as an Adhesion Layer for Cu Electroless Deposition on SiO2
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Wu, Pu-Wei; Koike, Junichi; Dordi, Yezdi; Chung, Wei-An; Fan, Tzu-Ling; Chou, Shih-Cheng |
| 國立交通大學 |
2019-08-02T02:15:34Z |
Conformal Deposition of RuO2 on Cu via a Galvanic Cementation Reaction
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Lin, Chun; Chou, Shih-Cheng; Tso, Kuang-Chih; Hsieh, Yi-Chieh; Chan, Ting-Shan; Chen, Po-Chun; Koike, Junichi; Wu, Pu-Wei |
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